| 摘要 |
PURPOSE: An apparatus for cleaning a semiconductor chip package is provided to effectively remove a foreign substance by using two kinds of brushes. CONSTITUTION: A first brush (112) is contacted with a semiconductor chip package to remove a foreign substance. The semiconductor chip package is fixed to a picker. A second brush (116) removes the foreign substance remaining in the semiconductor chip package. A nozzle part (120) includes nozzles. The nozzles spray water and air to the semiconductor chip package. |
