| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for processing wafers capable of fully suppressing the occurrence of transfer marks on an adhesive layer when winding a film for processing wafers having a dicing-die-bonding film made of an adhesive layer and a viscous film in a roll. SOLUTION: The film 10 for processing wafers includes: a base material film 11; a viscous film 12 made of a bonding agent layer provided on the base material film; and an adhesive layer provided on the bonding agent layer. The bonding agent layer contains radiation-polymerizable compounds and one photo initiator at a part corresponding to at least a ring frame, and radiation-polymerizable compounds and another photo initiator at a part other than places including one photo initiator. The wavelength of light to which one photo initiator reacts differs from that of light to which another photo initiator reacts. COPYRIGHT: (C)2010,JPO&INPIT |
