| 摘要 |
A polishing device which reduces a failure rate in generating a substrate by minimizing the depth of micro cracks. The polishing device (M) has a carrying line (1) composed of a carry-in line (2) for carrying an unpolished prismatic member (W) and a carry-out line (3) for carrying out a polished prismatic member (W) and a polishing line (10) having plane polishing devices (11) and corner polishing devices (12) disposed at positions respectively opposed to each other. Moreover, each plane polishing device (11) has a plane polishing device (11A) for rough polishing, a plane polishing device (11B) for first finish and a plane polishing device(11C) for second finish which are juxtaposed. Each corner polishing device (12) has a corner polishing device (12A) for rough polishing and a corner polishing device (12B) for finish which are juxtaposed. Between the respective plane polishing devices (11) and corner polishing devices (12), the prismatic member (W) placed on a traveling truck (5) is traveled to be polished. |
