发明名称 INJECTION MOLDING COMPOSITION
摘要 Provided is an injection molding composition which is high in thermal decomposability and is not easily deformed by debinding when the composition is heated and which can further give a satisfactory debound body in a short period even when the debound body originates from a molded body having a large wall thickness. The composition is an injection molding composition comprising a metallic powder that can be sintered, and an organic binder, in which the organic binder is constituted of a polylactic acid (a), a polyoxymethylene (b), a polypropylene (c), an organic compound (d) having a viscosity of 200 mPa�s or less at 150�C, and a thermoplastic resin (e) having a Vicat softening temperature of 130�C or lower.
申请公布号 EP2409797(B1) 申请公布日期 2013.08.28
申请号 EP20100753441 申请日期 2010.03.10
申请人 IHI CORPORATION 发明人 KANKAWA, YOSHIMITSU;NAKAGAWA, KATSUNORI
分类号 B22F3/02;B22F1/00;B22F3/10;C08K5/00;C08L23/10;C08L59/00;C08L59/02;C08L67/04;C08L101/00 主分类号 B22F3/02
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