| 摘要 |
<p>Disclosed are a resin composition for laser engraving including a resin having two groups having specific structures and having a number average molecular weight of 5,000 or more and 500,000 or less, a relief printing plate precursor for laser engraving comprising a relief-forming layer formed from the resin composition on a support, a process for making the relief printing plate precursor, a process of making a relief printing plate using the relief printing plate precursor, and a relief printing plate having a relief layer which is manufactured by the process.</p> |
