发明名称 SUBSTRATE PLASMA PROCESSING APPARATUS
摘要 PURPOSE: A plasma processing apparatus for a substrate is provided to deliver more current from a pulsed DC power supply to a plasma electrode, thereby generating high-power plasma under a fixed pulsed voltage condition. CONSTITUTION: A plasma processing apparatus for a substrate (10) comprises a first electrode (120) maintaining the substrate arranged in a reaction chamber (110); a second electrode (140) disposed to face the first electrode in the reaction chamber; a power supply unit (150) configured to apply a DC pulse to the first electrode; and an impedance transformer (155) disposed between the power supply unit and the first electrode, and configured to include at least one resistor element.
申请公布号 KR20130095433(A) 申请公布日期 2013.08.28
申请号 KR20120016850 申请日期 2012.02.20
申请人 INJE UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION 发明人 LEE, JE WON
分类号 H05H1/46;H01L21/205;H03H7/40 主分类号 H05H1/46
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