发明名称 |
SUBSTRATE PLASMA PROCESSING APPARATUS |
摘要 |
PURPOSE: A plasma processing apparatus for a substrate is provided to deliver more current from a pulsed DC power supply to a plasma electrode, thereby generating high-power plasma under a fixed pulsed voltage condition. CONSTITUTION: A plasma processing apparatus for a substrate (10) comprises a first electrode (120) maintaining the substrate arranged in a reaction chamber (110); a second electrode (140) disposed to face the first electrode in the reaction chamber; a power supply unit (150) configured to apply a DC pulse to the first electrode; and an impedance transformer (155) disposed between the power supply unit and the first electrode, and configured to include at least one resistor element. |
申请公布号 |
KR20130095433(A) |
申请公布日期 |
2013.08.28 |
申请号 |
KR20120016850 |
申请日期 |
2012.02.20 |
申请人 |
INJE UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
发明人 |
LEE, JE WON |
分类号 |
H05H1/46;H01L21/205;H03H7/40 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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