| 摘要 |
<p>Disclosed is a photosensitive resin composition which is extremely highly sensitive to light beams having a wavelength of 350-410 nm and has excellent resolution, adhesion and printout properties after exposure. In addition, the photosensitive resin composition has stable throughput and good solubility in a solvent and is capable of providing a resist that does not easily suffer from deposits. Specifically disclosed is a photosensitive resin composition which is characterized by containing (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator and (D) an N,N,N',N'-tetraarylbenzidine derivative represented by general formula (1) or (2). (In general formula (1), R1-R4 each independently represents an alkyl group having 1-6 carbon atoms, an alkoxy group having 1-6 carbon atoms, a halogen atom or an amino group.) (In general formula (2), R5 and R6 each independently represents an alkyl group having 4 or more carbon atoms, an alkoxy group having 4 or more carbon atoms, a halogen atom or an amino group.)</p> |
