发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a soldering jig capable of mounting an LED element on a board while the LED element is floated by a lead terminal. <P>SOLUTION: A first plate 11 provided with an opening exposing a solder surface of a board 10 includes: an LED holder 50 holding an LED element 54; and a locking member supporting the LED holder 50 so that a lead terminal 54a of the held element 54 is positioned just above a through hole 10c of the board 10. A second plate 12 is provided with a pressing member 60 pressing the LED holder 50. The locking member 52 of the plate 11 supports the LED holder 50 with a shaft capable of being extended and retracted freely. When the second plate 12 is placed over the first plate 11, the pressing member 60 presses the LED holder 50 to sink the shaft of the locking member, and the lead terminal 54a projects from the board 10 through the through hole 10c. A length of a sunk lead terminal 54a is set according to a size of the pressing member 60, and soldering is performed while the LED element 54 is floated and the opening of the plate 11 is faced upward. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5273062(B2) 申请公布日期 2013.08.28
申请号 JP20100018871 申请日期 2010.01.29
申请人 发明人
分类号 H05K3/34;B23K3/00;H01L33/00;H05K13/04 主分类号 H05K3/34
代理机构 代理人
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