| 摘要 |
<p>The invention concerns an organic photovoltaic component with a novel encapsulation, wherein the invention for the first time discloses packaging for organic solar cells that includes a low-cost film composite comprising a metal portion. The packaging meets high requirements, particularly with respect to
- high barrier properties against oxygen and water vapor
- encapsulation without or with only minimal adhesive joints, since the encapsulation can be welded/soldered to the substrate or the bottom electrode,
- integrated lead-through of electrical connections, including adhesive-bonded, soldered and/or welded connections.</p> |
