发明名称 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
摘要 <p>The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 in Pa.s at 150°C, as measured with an ICI cone-plate Brookfield viscometer.</p>
申请公布号 EP2631256(A1) 申请公布日期 2013.08.28
申请号 EP20130165927 申请日期 2009.01.09
申请人 HITACHI CHEMICAL CO., LTD. 发明人 KOTANI, HAYATO;URASAKI, NAOYUKI;MIZUTANI, MAKOTO
分类号 C08G59/42;C08K3/22;C08L63/00;H01L33/00;H01L33/48;H01L33/60 主分类号 C08G59/42
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