| 摘要 |
The present invention relates to a method for fabricating a resin composition for semiconductor packaging, wherein the resin composition comprises the following components (A) to (C): (A) epoxy resin; (B) curing agent; and (C) inorganic filler. The method comprises the following steps: preparing a mixture which contains the components (A) and (B) with average granularities of 5-50 mu m and further contains the component (C); storing the mixture into a container which is used for sending the mixture to a melting mixing roll; sending the stored mixture from the container to the melting mixing roll thereby preparing the mixed material; cooling and curing the mixed material, and finally crushing. |
