METHOD AND APPARATUS FOR ATTACHMENT OF INTEGRATED CIRCUITS

摘要

PURPOSE: A method for attaching an integrated circuit and an apparatus thereof are provided to implement proper formation of a solder bond, by constituting to perform an electrical test at a tap and a solder pad. CONSTITUTION: A conductive trace includes a solder pad (32). The solder pad has distal length (34) additionally. Another solder pad (36) is bonded to a center tap of an integrated circuit (IC). One end of the center tap is soldered to the pad end. A first electric conductivity bonding pad is fixed to a component.