PURPOSE: A boat for loading a semiconductor substrate is provided to reduce process time, by not using a dummy wafer. CONSTITUTION: A top plate (20) and a bottom plate (10) are separated from each other. A load (30) is formed between the top plate and the bottom plate. A plurality of buffer plates (40) is arranged with a first gap along the length direction of the load. A supporting part is formed between a first buffer plate and a second buffer plate. The supporting part supports a semiconductor substrate.
申请公布号
KR20130095495(A)
申请公布日期
2013.08.28
申请号
KR20120016976
申请日期
2012.02.20
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KANG, SUNG HO;KUH, BONG JIN;KIM, KI SEOK;KIM, KI CHUL;KIM, IK SOO;JOO, YONG KYU;HA, SANG CHEOL