Apparatus and method of transferring semiconductor packages in a sawing and sorter system

摘要

PURPOSE: An apparatus and a method for transferring a semiconductor packages in a sawing and a sorter system are provided to rapidly transfer divided semiconductor packages by using a unit pickers and a chip pickers. CONSTITUTION: A chuck table(110) supports semiconductor package sets cut by a spindle. A first stage(120) and a second stage(130) support semiconductor packages. Unit pickers(140) transfer one or two sets to the first stage. Chip pickers(160) transfer the semiconductor package sets of the first stage to two regions of the second stage separately.