发明名称 Thermal curing resin composition for spinless coating
摘要 PURPOSE: A thermosetting resin composition is provided to save a composition solution by substantially being coated thickly although the composition is applied in the same discharge amount as other compositions with the same solid content. CONSTITUTION: A thermosetting resin composition for spinless comprises an acrylic binder resin and a polyfunctional monomer including 5 or more acryl groups in a weight ratio of 5:1 ~ 0.86:1. The acrylic binder resin is a compound represented by chemical formula 1. In chemical formula 1, A is a methyl or hydrogen atom, B is C1-6 alkyl group or hydroxy alkyl group, C is an ethylenic unsaturated group including an epoxy group; and X and Y which are the same or different represent an olefinic monomer which contain or does not contain an acryl group.
申请公布号 KR101299967(B1) 申请公布日期 2013.08.27
申请号 KR20090056099 申请日期 2009.06.23
申请人 发明人
分类号 C08L33/06;C08L33/08;C08L33/12;G02F1/1334 主分类号 C08L33/06
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