发明名称 |
Semiconductor system with fine pitch lead fingers and method of manufacturing thereof |
摘要 |
A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.
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申请公布号 |
US8519517(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US201113194874 |
申请日期 |
2011.07.29 |
申请人 |
LEE HUN TEAK;KIM JONG KOOK;KIM CHULSIK;JANG KI YOUN;STATS CHIPPAC LTD. |
发明人 |
LEE HUN TEAK;KIM JONG KOOK;KIM CHULSIK;JANG KI YOUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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