发明名称 |
Implementing selective rework for chip stacks and silicon carrier assemblies |
摘要 |
A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
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申请公布号 |
US8519304(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US20100833252 |
申请日期 |
2010.07.09 |
申请人 |
BARTLEY GERALD KEITH;BECKER DARRYL JOHN;GERMANN PHILIP RAYMOND;MAKI ANDREW BENSON;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTLEY GERALD KEITH;BECKER DARRYL JOHN;GERMANN PHILIP RAYMOND;MAKI ANDREW BENSON |
分类号 |
B23K1/018;B23K3/047 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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