Thermal conductive resin composition

摘要

A thermal-conductive resin composition which can provide an molded article excellent in thermal conductivity and/or mechanical strength is provided. The resin composition comprising a resin selected from a thermosetting resin and a thermoplastic resin; a granule having a number average particle diameter of 0.5 to 5 mm and comprising alumina fibers with a number average fiber diameter of 1 to 50 mum; and an alumina fine particle.