发明名称 |
Semiconductor encapsulation and method thereof |
摘要 |
A semiconductor encapsulation comprises a lead frame further comprising a chip carrier and a plurality of pins in adjacent to the chip carrier. A plurality of grooves opened from an upper surface of the chip carrier partially dividing the chip carrier into a plurality of chip mounting areas. A bottom portion of the grooves is removed for completely isolate each chip mounting area, wherein a width of the bottom portion of the grooves removed is smaller than a width of the grooves. In one embodiment, a groove is located between the chip carrier and the pins with a bottom portion of the groove removed for isolate the pins from the chip carrier, wherein a width of the bottom of the grooves removed is smaller than a width of the grooves.
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申请公布号 |
US8519525(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US20100846034 |
申请日期 |
2010.07.29 |
申请人 |
XUE YAN XUN;BHALLA ANUP;LU JUN;ALPHA & OMEGA SEMICONDUCTOR, INC. |
发明人 |
XUE YAN XUN;BHALLA ANUP;LU JUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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