| 摘要 |
PURPOSE: A method for manufacturing a semiconductor package is provided to reduce the number of process and process time by forming an UBM by using a redistribution line as a plating line after the redistribution line is formed. CONSTITUTION: A first passivation layer(16) is formed in a surface except the bonding pad(12) of a semiconductor chip(10). A first seed layer(20) is formed in the upper surface of the bonding pad and the first passivation layer. A first photoresist is coated on the surface of the first passivation layer. A redistribution line(18) is formed on the first seed layer. A second photoresist is coated on the area except the other end part of the redistribution line. An UBM is formed on the other end part of the redistribution line. |
