发明名称 |
Method for manufacturing semiconductor device including removing a resin burr |
摘要 |
A method of manufacturing a semiconductor device comprises: preparing a lead frame including a package external region and a package internal region, a burred surface being provided at a top end of a side of the lead frame, and a fracture surface being provided in the vicinity of the top end of the side; chamfering the top end of the side in the package external region; mounting a semiconductor element on the lead frame and sealing the semiconductor element with mold resin in the package internal region; and removing resin burr provided on the side of the lead frame in the package external region after the chamfering and the sealing.
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申请公布号 |
US8518751(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US201113213593 |
申请日期 |
2011.08.19 |
申请人 |
SAKAMOTO KEN;SHIKANO TAKETOSHI;TANAKA MITSUGU;SASAKI TAISHI;MITSUBISHI ELECTRIC CORPORATION |
发明人 |
SAKAMOTO KEN;SHIKANO TAKETOSHI;TANAKA MITSUGU;SASAKI TAISHI |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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