发明名称 Semiconductor device
摘要 A semiconductor device includes a first insulating film formed between a gate electrode and a first flat semiconductor layer, and a sidewall-shaped second insulating film formed to surround an upper sidewall of a first columnar silicon layer while contacting an upper surface of the gate electrode and to surround a sidewall of the gate electrode and the first insulating film. The semiconductor device further includes a metal-semiconductor compound formed on each of an upper surface of a first semiconductor layer of the second conductive type formed in the entirety or the upper portion of the first flat semiconductor layer, and an upper surface of the second semiconductor layer of the second conductive type formed in the upper portion of the first columnar semiconductor layer.
申请公布号 US8519475(B2) 申请公布日期 2013.08.27
申请号 US201113289742 申请日期 2011.11.04
申请人 MASUOKA FUJIO;NAKAMURA HIROKI;ARAI SHINTARO;KUDO TOMOHIKO;SINGH NAVAB;BUDDHARAJU KAVITHA DEVI;NANSHENG SHEN;SAYANTHAN RUKMANI DEVI;UNISANTIS ELECTRONICS SINGAPORE PTE LTD. 发明人 MASUOKA FUJIO;NAKAMURA HIROKI;ARAI SHINTARO;KUDO TOMOHIKO;SINGH NAVAB;BUDDHARAJU KAVITHA DEVI;NANSHENG SHEN;SAYANTHAN RUKMANI DEVI
分类号 H01L29/66 主分类号 H01L29/66
代理机构 代理人
主权项
地址