发明名称 |
Metallization processes, mixtures, and electronic devices |
摘要 |
One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device. |
申请公布号 |
US8518826(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US20100835534 |
申请日期 |
2010.07.13 |
申请人 |
KOLICS ARTUR;REDEKER FRITZ;LAM RESEARCH CORPORATION |
发明人 |
KOLICS ARTUR;REDEKER FRITZ |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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