发明名称 |
Apparatus for laminating a film on a wafer |
摘要 |
An apparatus for laminating a film on a wafer includes a cutting mechanism and a laminating mechanism. The cutting mechanism has a cutting device disposed thereon for pre-cutting a dry film. The cutting mechanism has a supporter disposed adjacent to the cutting device for positioning a wafer. The cutting mechanism has a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter. The laminating mechanism has a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer.
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申请公布号 |
US8517074(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US201213345756 |
申请日期 |
2012.01.09 |
申请人 |
LAI CHIN-SEN;CHEN MING-TSUNG;C SUN MFG. LTD. |
发明人 |
LAI CHIN-SEN;CHEN MING-TSUNG |
分类号 |
B29C65/00;B32B37/00;B32B38/04;B32B38/10 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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