发明名称 Circuit board and manufacturing method thereof
摘要 A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer.
申请公布号 US8519270(B2) 申请公布日期 2013.08.27
申请号 US20100782900 申请日期 2010.05.19
申请人 CHANG CHEN-CHUAN;UNIMICRON TECHNOLOGY CORP. 发明人 CHANG CHEN-CHUAN
分类号 H05K1/00 主分类号 H05K1/00
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