发明名称 FABRICATING METHOD OF MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MULTILAYERED CERAMIC ELECTRONIC COMPONENT FABRICATED THEREBY
摘要 <p>PURPOSE: A method for fabricating a multilayered ceramic electronic component and the multilayered ceramic electronic component fabricated thereby are provided to increase the density of an internal electrode by being cured at the same time. CONSTITUTION: An organic material is printed on a ceramic green sheet (A2). The ceramic green sheet is laminated in turn (A3). A green chip is fabricated by cutting the green laminated body. The organic material in the green chip is removed (A5). An internal electrode is formed in a cavity for the internal electrode (A7). [Reference numerals] (A1) Manufacture a ceramic green sheet; (A2) Print an organic material for forming an inner electrode cavity; (A3) Laminate multiple sheets in turn; (A4) Compress and cut; (A5) Plasticize a dielectric and remove the organic material; (A6) Inject inner electrode paste; (A7) Plasticize an inner electrode; (A8) Spread an outer electrode</p>
申请公布号 KR20130094439(A) 申请公布日期 2013.08.26
申请号 KR20120015682 申请日期 2012.02.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, HO YOON;SONG, SEON KI;CHOI, SUNG HYUK
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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