METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING MODIFIED RECTANGULAR MASK PATTERNS TO INCREASE RELIABILITY OF CONTACTS TO ELECTRICALLY CONDUCTIVE LINES

摘要

PURPOSE: A method for manufacturing an integrated circuit device using a modified rectangular mask pattern for increasing the contact reliability of a conductive line is provided to implement high integration with an electrical contact. CONSTITUTION: A first conductive line (112a) and a second conductive line (112b) are located on an integrated circuit board in parallel. The first conductive line and the second conductive line are selectively etched on a pair of electric interconnections with facing ends. The facing ends are defined by using a photolithography mask with a modified rectangular mask pattern. A photoresist pattern (104a) is defined on the integrated circuit board by using the modified rectangular mask pattern. The modified rectangular mask pattern includes a first mask pattern (100) and a second mask pattern (102a,102b) which are rectangular.