| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient, low-cost, and novel method for polishing a crystal wafer end face and rotary grinding wheel for use in the same.SOLUTION: A rotary grinding wheel for polishing an end face of a crystal wafer includes: an annular metal bond grinding wheel part obtained by binding abrasive grains with a metal bond; and an annular resin bond grinding wheel part obtained by binding abrasive grains with a resin bond. The metal bond grinding wheel part and the resin bond grinding wheel part are laminated coaxially and fixed. Rough polishing is performed by the metal bond grinding wheel part containing the abrasive grains having a relatively large grain size and mirror polishing is performed by the resin bond grinding wheel part containing the abrasive grains having a relatively small grain size. Accordingly, the end face machining of the crystal wafer can be continuously performed by one rotary grinding wheel from the rough polishing to the mirror polishing. |
