| 摘要 |
PROBLEM TO BE SOLVED: To average heat extraction amounts of multiple semiconductor elements with a simple structure.SOLUTION: A semiconductor cooling device 1 includes: a refrigerant passage 2 where a refrigerant flows; multiple semiconductor elements 5 disposed at the outer side of the refrigerant passage 2; multiple fins 6 disposed in parallel with the flow of the refrigerant at the inner side of the refrigerant passage 2 so as to transmit heat of the multiple semiconductor elements 5 to the refrigerant; and means for circulating the refrigerant in the refrigerant passage 2. The refrigerant passage 2 is formed so that a flow rate of the refrigerant gradually increases toward the downstream side. This structure compensates the deterioration of a heat extraction amount of the fins 6, which is caused by temperature rise in the refrigerant, thereby averaging the cooling states of the semiconductor elements 5 which is observed in a refrigerant flow direction. |
