| 发明名称 |
CIRCUIT BOARD, STRUCTURAL UNIT THEREOF AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board. |
| 申请公布号 |
US2013213693(A1) |
申请公布日期 |
2013.08.22 |
| 申请号 |
US201313757853 |
申请日期 |
2013.02.04 |
| 申请人 |
HTC CORPORATION;HTC CORPORATION |
发明人 |
HO CHIN-WEI;TSAI HUI-LING |
| 分类号 |
H05K3/00;H05K1/02 |
主分类号 |
H05K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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