| 摘要 |
In a high-performance heat dissipating lamp, a heat dissipating module is clamped between a substrate having a plurality of power supply devices and a lamp base having a plurality of LED modules to separate the power supply devices and the LED modules, and the LED module are arranged with a gap apart from each other, and coupled to the power supply devices one by one, so that heat released from the LED module or the power supply device will not be accumulated in a single circuit board, and the airflow between the LED module and the power supply device can flow faster to improve the heat dissipating efficiency, while each separate power supply device and each separate LED module can facilitate maintenance and repair, or replacement of components.
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