发明名称 |
LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device. |
申请公布号 |
US2013214316(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201213572684 |
申请日期 |
2012.08.12 |
申请人 |
LAI CHIH-CHEN;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LAI CHIH-CHEN |
分类号 |
H01L33/62;H01L33/36;H01L33/52 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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