摘要 |
The purpose of the present invention is to provide an image evaluation method and an image evaluation apparatus for estimating exposure conditions by evaluating a two-dimensional shape of a semiconductor pattern, and a shape change of a pattern side wall on the basis of an SEM image. In order to achieve the above-mentioned purpose, a method and an apparatus are provided, said method and apparatus being provided with: a storage unit, which stores a model that indicates relationships between exposure conditions and feature quantities obtained by generating a plurality of profile lines on the basis of an SEM image, and profile line generating parameter information that corresponds to the model; a profile line generating unit, which generates, on the basis of the SEM image, a plurality of profile lines using the profile line generating parameter information; and an estimating unit, which obtains exposure conditions using the model, and the feature quantities obtained on the basis of the profile lines generated by means of the profile line generating unit. |