ELECTRONIC PART AND METHOD OF MANUFACTURE THEREOF

摘要

The purpose of the present invention is to obtain an electronic part that is not liable to malfunction even when thermal shock is applied thereto repeatedly, such as in a thermal shock test. In this electronic part (1), an electronic part element (3) is mounted on a ceramic substrate (2) with a gap (A) therebetween, and a resin sealing layer (6) is disposed on the ceramic substrate (2) so as to seal the electronic part element (3). The resin sealing layer (6) comprises a first resin sealing layer (6a) that is provided so as to cover the electronic part element (3) along with the gap (A), and a second resin sealing layer (6b) that is positioned on top of the first resin sealing layer (6a). The linear thermal expansion coefficient of the second resin sealing layer (6b) is lower than the linear thermal expansion coefficient of the first resin sealing layer (6a).