| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate which improves the yield of the manufacturing processes.SOLUTION: A ceramic multilayer substrate 1 includes: a ceramic substrate part 2 formed by burning multiple ceramic green sheets; and a chip type electronic component 3 disposed in the ceramic substrate part 2. The ceramic multilayer substrate 1 includes gap fillers 5 which are formed into fillet shapes and are located around chip type electronic component electrodes 4 of the chip type electronic component 3. Thus, the structure improves the yield of the manufacturing processes of the ceramic multilayer substrate 1. |
