发明名称 COMPONENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a component module improved in terms of the yield rate.SOLUTION: A component module includes a touch sensor 400 provided on a sheet 100, a connection part 500 connected to the touch sensor 400 and having an external connection part 530, and a resin part 300 provided on the sheet 100. The resin part 300 has the touch sensor 400 and the connection part 500 embedded therein and has a first opening 320 that exposes at least the external connection part 530 to the outside.
申请公布号 JP2013164716(A) 申请公布日期 2013.08.22
申请号 JP20120027108 申请日期 2012.02.10
申请人 HOSIDEN CORP 发明人 SHINODA KOJI;ISODA TAKESHI
分类号 G06F1/18 主分类号 G06F1/18
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