| 摘要 |
PROBLEM TO BE SOLVED: To provide a suction collet, along with a method of manufacturing a semiconductor device, capable of well sucking a semiconductor chip when picking it up from a dicing tape, suppressing occurrence of deflection or warping at an overhang part of the semiconductor chip, and suppressing damage of the semiconductor chip.SOLUTION: A suction collet 60 bonds a second semiconductor chip 21 on a first semiconductor chip 14, in such a manner as it protrudes from the first semiconductor chip 14 along X direction. A first portion 63 that sucks a corner part 21E of the second semiconductor chip 21 is made from a first elastic body 67. A second portion 64 which is other than a portion that sucks the corner part 21E of the second semiconductor chip 21 is made from a second elastic body 68 that is harder than the first elastic body 67. |
