| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of encapsulating an electronic device in a cavity formed between a substrate and a lid that covers the upper surface of the substrate at a lower temperature than in conventional cases without causing damage to the electronic device.SOLUTION: An electronic device is encapsulated in a cavity 4 when a lid 3 is pressurized against a substrate 2, at a low temperature of 150°C or below or at an atmospheric temperature in a non-heated state, by joining two new metal surfaces one of which is obtained by a sharp top end of a metal encapsulation part 10 that is formed on the upper surface of the substrate 2 as to surround the circumference of the cavity 4 and whose top end of longitudinal section has a sharp shape being pressed and crushed against a metal film 5 formed under the lower surface of the lid 3 and the other of which is obtained without containing contaminant such as an oxide film and organic materials on the surface of the metal film 5 by the sharp top end of the metal encapsulation part 10 being pressed and rubbed. Thus the electronic device can be encapsulated in the cavity 4 without being damaged by heat and energy wave in conventional cases. |
