| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to appropriately connect a thick film resistor on a metallization surface while realizing a fine line in an electronic device having a ceramic substrate having a metallization layer composed of Mo on one surface and a thick film resistor connected on the metallization surface.SOLUTION: The electronic device comprises: a ceramic substrate 10; a metalization layer 21 composed of Mo on one surface 11 of the ceramic substrate; and a thick film resistor 30 connected on the metalization layer on one surface side of the ceramic substrate. The metalization surface is sequentially laminated from the metalization layer side with a Ni plating layer 22, a Pd plating layer 23, and a Cu plating layer 24, and the thick film resistor is directly connected to a surface of the Cu plating layer. |
