发明名称 METHOD FOR GROWING SILICON SINGLE CRYSTAL AND METHOD FOR PRODUCING SILICON WAFER
摘要 PROBLEM TO BE SOLVED: To provide a growing method of a silicon single crystal, which can reduce fluctuation of resistivity in the axial direction of pulling the silicon single crystal, and in-plane resistivity in the radial direction.SOLUTION: The pulling speed of a silicon single crystal is defined as the pulling speed including a generation area of COP defects. The growth method of silicon single crystal comprises pulling a silicon single crystal containing an n-type dopant from a quartz crucible, where the interstitial oxygen concentration in the silicon single crystal is 6.0×10atoms/cmor less, the variation &Dgr;&rgr; of radial in-plane resistivity of the silicon single crystal is 5% or less; thereafter supplying silicon raw materials into a quartz crucible to be melted; and pulling newly a silicon single crystal from the crucible thereby growing a plurality of silicon single crystals.
申请公布号 JP2013163642(A) 申请公布日期 2013.08.22
申请号 JP20130111442 申请日期 2013.05.28
申请人 SUMCO CORP 发明人 MURAKAMI HIRONORI;KATO KOJI
分类号 C30B29/06;C30B33/02 主分类号 C30B29/06
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