| 摘要 |
PROBLEM TO BE SOLVED: To achieve good bonding between a package structure and a substrate, and achieve long life of solder bonding even when heat stress is added.SOLUTION: A semiconductor device comprises: a package structure including a semiconductor chip, an island 112 of the lead frame and the plurality of external connection terminals 106, which are encapsulated by an encapsulation resin from one surface side, and the island 112 and the plurality of external connection terminals 106 which are exposed on the other surface side. The external connection terminals 106 of a lead frame 110 used for the package structure includes: first external connection terminals 106a which are arranged at a central part of each outer edge of a semiconductor mounting region 154 on which a semiconductor chip is mounted; and second external connection terminals 106b which are arranged on the outer side of the first external connection terminals 106a on each of the outer edges of the semiconductor chip mounting region 154. Each of the first external connection terminals 106a has a larger area than each of the second external connection terminals 106b. |
