| 发明名称 |
Component and Method for Producing a Component |
| 摘要 |
A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
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| 申请公布号 |
US2013214405(A1) |
申请公布日期 |
2013.08.22 |
| 申请号 |
US201113818916 |
申请日期 |
2011.07.29 |
| 申请人 |
BAUER CHRISTIAN;KRUEGER HANS;PORTMANN JUERGEN;STELZL ALOIS;EPCOS AG |
发明人 |
BAUER CHRISTIAN;KRUEGER HANS;PORTMANN JUERGEN;STELZL ALOIS |
| 分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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