发明名称 |
COMPOSITE HEAT-DISSIPATION SUBSTRATE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.
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申请公布号 |
US2013213629(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201213726378 |
申请日期 |
2012.12.24 |
申请人 |
MATERIALS KOREA INSTITUTE OF MACHINERY &;KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
LEE SANG-KWAN;LEE SANG-BOK;YUN JUNG-YEUL |
分类号 |
F28F21/04;B29C67/04;F28F21/08 |
主分类号 |
F28F21/04 |
代理机构 |
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