| 摘要 |
The invention relates to a method for the temporary connection of a product substrate (2) to a carrier substrate (6), comprising the following method steps: - application of a connecting layer (5) onto a product substrate-accepting side (60) of the carrier substrate (6) in a connecting surface section (13) of the product substrate-accepting side (60), - application of an anti-adhesion layer (4) having a low adhesive force onto a connecting side (2u) of the product substrate (2) in an anti-adhesion surface section (15) of the connecting side (2u), the area of which at least partially, in particular predominantly, preferably substantially entirely corresponds to the area of the connecting surface section (13), wherein an accepting space (14) delimited by the connecting layer (5) and the carrier substrate (6) as well as the product substrate (2) and the anti-adhesive layer (4) is formed for receiving structures (3) that protrude from the connecting side (2u) and that are provided on the connecting side (2u) of the product substrate (2), - alignment of the product substrate (2) relative to the carrier substrate (6) and connection of the connecting layer (5) to the anti-adhesive layer (4) on a contact surface (16). |
