A device can include a housing, a fan, and a heat sink. The heat sink can dissipate heat from a processor card. The device can be installed into a chassis of a computer.
申请公布号
WO2013122570(A1)
申请公布日期
2013.08.22
申请号
WO2012US24924
申请日期
2012.02.13
申请人
HAWLETT-PACKARD DEVELOPMENT COMPANY, LP;OWEN, RICHARD;BASSETT, JONATHAN, D.;QUIJANO, DAVID
发明人
OWEN, RICHARD;BASSETT, JONATHAN, D.;QUIJANO, DAVID
