LOW MELTING TEMPERATURE GLASS FRIT COMPOSITION FOR LASER SEALING, LOW MELTING TEMPERATURE GLASS FRIT USING THE SAME AND SEALING METHOD OF AMOLED USING THE LOW MELTING TEMPERATURE GLASS FRIT

摘要

PURPOSE: A glass frit composition with low melting point, excellent durability and water resistance for laser sealing is free lead and is able to be melted at low temperatures by easily absorbing laser lights. CONSTITUTION: A glass frit composition with low melting point comprises 30-60 weight% of V_2O_5, 1-10 weight% of BaO, 1-10 weight% of ZnO, 10-20 weight% of P_2O_5, 10-30 weight% of TeO_2, 1-5 weight% of Cu_2O, 5 weight% of Fe_2O_3, and 10-30 weight% of SeO_2. The glass frit composition with low melting point is characterized in; absorbing more than 80% of infrared light in the wavelength band of 800-820nm; having the glass transition temperature (Tg) of 300-400°C, the curing temperature (Tdsp) of 400-500°C and the average coefficient of thermal expansion of 5x10^-6/°C or 9x10^-6/°C within the temperature range of 50-250°C after firing. [Reference numerals] (AA) Start; (BB) End; (S110) Preparing a first and a second plates; (S120) Forming sealing material containing glass frit; (S130) Aligning the first and the second plates; (S140) Irradiating laser on the sealing material