Method for separating silicon wafer from each other by semiconductor material ingot using e.g. multi-wire saw, involves separating wafers from each other by relative movement between ingot and wire groups

摘要

The method involves moving a wire (D) by using multiple grooved rollers (W) to form wire groups (DF), which are extended mutually parallel to each other, where the wire exhibits a non-circular cross-sectional area e.g. oval or elliptical cross-sectional area, which represents a cross-sectional area that is larger than a cross-sectional area of a usually used circular wire. Semiconductor wafers are separated from each other by a relative movement between a semiconductor material ingot (BL) and the wire groups. An independent claim is also included for a wire saw for separating semiconductor wafers from each other by a semiconductor material ingot.