发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which has a stable radiation performance from a semiconductor module even at a high temperature and has good dimensional accuracy; and provide a manufacturing method of the same.SOLUTION: A semiconductor device comprises: a semiconductor module 2 including a semiconductor element 4, and a module-side base plate 6 on which the semiconductor element 4 is arranged on a first surface and a first irregularity part 9 is formed on a second surface opposite to the first surface; and a radiator 3 on which a second irregularity part 12 that fits the first irregularity part 9 is formed on a third surface facing the second surface and which radiates heat generated by the semiconductor element 4. The module-side base plate 6 and the radiator 3 are made of different metal materials, and when either of the first irregularity part 9 or the second irregularity part 12 is plastic-deformed, the semiconductor module 2 and the radiator 3 are fastened to each other.
申请公布号 JP2013165122(A) 申请公布日期 2013.08.22
申请号 JP20120026425 申请日期 2012.02.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKECHI ATSUSHI;KASHIBA YOSHIHIRO;SHIRAKATA YUJI;NAKAJIMA YASUSHI
分类号 H01L23/40 主分类号 H01L23/40
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