发明名称 CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable composition which is usable as a sealing material, an adhesive, and a coating material, and which exhibits fast curing properties by curing the curable composition in a certain period of time.SOLUTION: A curable composition, which includes an organic polymer (A) having a reactive silicon group containing a halogen atom (such as a chloromethyl dimethoxy silyl group), and an amine compound (B) having a primary amino group and/or a secondary amino group, is cured in a certain period of time.
申请公布号 JP2013163787(A) 申请公布日期 2013.08.22
申请号 JP20120028743 申请日期 2012.02.13
申请人 KANEKA CORP 发明人 MIYAFUJI SEI;WAKABAYASHI KATSUO
分类号 C08L101/10;C08K5/17;C08L33/04;C08L71/02;C09J133/14;C09J157/00;C09J171/02;C09J201/10;C09K3/10 主分类号 C08L101/10
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