| 摘要 |
PROBLEM TO BE SOLVED: To facilitate subsequent handling while processing a wafer, by stably supporting the wafer which is made thin by grinding.SOLUTION: When a wafer W comprising, on a surface thereof, a device region where a plurality of devices are formed and an outer circumferential surplus region surrounding the device region is processed, a recess W3 is formed in a region corresponding to the device region within a rear surface Wb of the wafer W, and a ring shaped reinforcing portion W4 including the outer circumferential surplus region is left on an outer circumferential side of the recess W3. Since the outer circumferential side of the device region is reinforced by the ring shaped reinforcing portion W4, subsequent handling of the wafer is facilitated. |
